電鍍相關知識貼[結構設計必備]

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接上：镀前处理和镀后处理
1 镀前处理  preplating
0 ?$ O: b+ ]. S  ~' W1 J! w2 镀后处理  postplating
3 化学抛光  chemical polishing
: I1 p  C- D3 y) H4 W4 化学除油  alkaline degreasing
/ i: T* d* @7 C  `  N5 电抛光  electropolishing
' q. m$ J+ g8 H+ G/ V6 电解除油  electrolytic degreasing
7 电解浸蚀  electrolytic pickling
8 浸亮  bright dipping
, {3 _, i, y  \, H2 i  z9 q# D9 机械抛光  mechanical polishing
10 有机溶剂除油  solvent degreasing
11 光亮浸蚀  bright pickling
$ r0 S  l) b9 U0 {  q/ s* v12 粗化  roughening
13 敏化  sensitization
5 ]5 C% R' L( G0 ]2 M& ?5 P14 汞齐化  amalgamation (blue dip)
, I" @4 f7 r% v* i# y15 刷光  brushing
16 乳化除油  emulsion degreasing
17 除氢  removal of hydrogen (de-embrittlement )
18 退火  annealing
. Z5 _9 \7 K2 J% N0 K$ L19 逆流漂洗  countercurrent rinsing
20 封闭  sealing
21 着色能力  dyeing power
22 退镀  stripping
23 热扩散  thermal diffusion
24 热熔  hot melting
25 着色  colouring
% X0 V7 y8 s' z26 脱色  decolorization
$ `% J1 l' X  w+ q: h+ X27 喷丸  shot blasting
) J/ d; j6 F$ ~- ?28 喷砂  sand blasting
# Y7 F5 k/ Y6 ?29 喷射清洗  spray rinsing
30 超声波清洗  ultrasonic cleaning
6 m& j: s% J$ V# _2 ~31 弱浸蚀  acid dipping
. P5 ^) A9 _- w' R3 @32 强浸蚀  pickling
7 j1 X/ @( E, |/ i' L33 滚光  barrel burnishing
( ]2 X/ {. X! E) F5 O9 c3 U4 \34 磨光  grinding

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接上材料和设备
1 水的软化 softening of water
4 t- N" j1 R! t/ d0 H. y0 T1 K2 汇流排 busbar
: D$ q- u% }. u, h3 r+ `5 |3 阳极袋 anode bag
( C$ ~) a4 G( |- n) K& W4 光亮剂 brightening agent (brightener)
9 O. A9 N7 M$ v: l4 V- E5 {& p( Z5 助滤剂 filteraid
6 阻化剂 inhibitor
7 表面活性剂 surface active agent(surfactant)
5 l- I0 A" c5 Z/ b$ M8 乳化剂 emulsifying agent(emulsifier)
9 配位剂 complexant
10 绝缘层 insulated layer(resist)
11 挂具(夹具)  plating rack
/ x5 A: J0 i& C1 W. w! {# c% s12 润湿剂 wetting agent
13 离心干燥机 centrifuge
8 K. p% c) \$ P1 N! u14 添加剂 addition agent(additive)
4 o4 u4 Z' C2 B% V2 e* ]15 缓冲剂 buffer
16 移动阴极 swept cathode
: H  R' s/ _8 l% r$ Y17 隔膜 diaphragm
18 整合剂 chelating agent
19 整平剂 leveling agent
' l( V9 O% Y% x20 整流器 rectifier

/ {% }+ v) v$ h) O. c2 V* b- Z# ?( x3 O* q镀覆方法
! E& u: h1 b$ N7 O, x, `1 化学气相沉积  chemical vapor deposition
. Y# l7 M5 C, s) ^1 q2 物理气才目沉积  physical vapor deposition
3 化学钝化  chemical passivation
4 化学氧化  chemical oxidation
" S3 ?: I" s  G' W( o5 阳极氧化  anodizing
6 化学镀(自催化镀)  autocalytic plating
7 激光电镀  1aser electroplating
" h( O% J* k9 c( s& a! a8 闪镀  flash(flash plate)
  u: s; V4 \" }9 电镀  electroplating
10 机械镀  mechanical plating
11 浸镀  immersion plate
12 电铸  electroforming
13 叠力口电流电镀  superimposed current electroplating
14 光亮电镀  bright plating
% o; \) X0 J/ M3 X15 合金电镀  alloy plating
16 多层电镀  multiplayer plating
17 冲击镀  strike plating
$ _4 p9 L5 U! E' V* {; X8 M18 金属电沉积  metal electrodeposition
! e4 O) n, X2 F$ k19 刷镀  brush plating
20 周期转向电镀  periodic reverse plating
21 转化膜  conversion coating
22 挂镀  rack plating
23 复合电镀(弥散电镀)  composite plating
24 脉冲电镀  pulse plating
25 钢铁发蓝(钢铁化学氧化)  blueing (chemical oxide)
3 i, C( }, ?' D. K+ }. T9 E% b6 z26 高速电镀  high speed electrodeposion
27 滚镀  barrel plating
28 塑料电镀  plating on plastics
- J( a- L1 [% C" b6 X29 磷化  phosphating
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% v  H5 ^) U+ K5 r% u1 w测试和检验
1 大气暴露试验 atmospheric corrosion test
* b2 L. K2 U- r# Q- V0 U2 中性盐雾试验(NSS试验)  neutral salt spray test(NSS-test)
. o9 F/ ]0 [$ a' s3 不连续水膜 water break
, O' e& `7 s# f/ C2 x* T8 ~0 w9 l. a4 pH计  pH meter
5 孔隙率  porosity
4 S0 l2 c( `2 h6 内应力  internal stress
7 电导仪  conductivity gauge
8 库仑计(电量计)  coulomb meter
' |$ N+ s. [* J- Y5 B( x9 旋转圆盘电极  rotating disk electrode
* {0 @+ V3 [% V/ I* b7 i10 旋转环盘电极  rotating ring disk electrode
11 针孔  pores
12 铜加速盐雾试验(CASS试验)  copper accelerated salt spray
# }3 a) M/ P$ K! z" c3 e        (CASS test )
13 参比电极  reference electrode
9 y# F5 c: L6 r, @8 t14 甘汞电极  calomel electrode
+ h) J9 I9 r; z( |, s8 H  V5 |15 可焊性  solder ability
0 ?. m7 o- L% c3 v16 硬度  hardness
17 金属变色  tarnish
/ q9 }1 d' M( \) c$ J, _/ r/ f0 ?18 点滴腐蚀试验  dropping corrosion test
19 玻璃电极 glass electode
* _- ]' X1 O! f3 ]" @/ v3 C; W20 结合力  adhesion
% I- K3 e" d2 U! ~' T  ~21 哈林槽  Haring cell
. w. |. O* J9 j. s/ b' ^# ]: `  x22 恒电势法  potentiostatic method
, R& m( c& |3 c6 C% K& b23 恒电流法  galvanostatic method
24 交流电流法  a.c method
# E0 v  ~/ R4 F9 H25 树枝状结晶  trees
26 脆性  brittleness
27 起皮  peeling
/ m3 K: |: X5 X- J! q28 起泡  blister
29 剥离  spalling
30 桔皮  orange peel