電鍍相關知識貼[結構設計必備]

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接上：镀前处理和镀后处理
" o! b7 i2 z- p1 ]2 }1 镀前处理  preplating
2 镀后处理  postplating
9 A7 P2 O- k/ Q: G8 E3 化学抛光  chemical polishing
4 化学除油  alkaline degreasing
9 k# o& c+ M  Q- A' m5 电抛光  electropolishing
2 c3 B5 Q  ^( a3 K# e9 y6 电解除油  electrolytic degreasing
7 电解浸蚀  electrolytic pickling
  W& j& h0 V% P2 R' w0 t; a- {0 \8 浸亮  bright dipping
. K( T% G. ~* x6 N0 h7 [% g9 机械抛光  mechanical polishing
( `, g& h9 [7 _5 ~8 t* }( ]10 有机溶剂除油  solvent degreasing
8 Q6 o! \+ k5 F9 S11 光亮浸蚀  bright pickling
/ ]7 o4 j; P, \) s8 j! I" ?9 E12 粗化  roughening
& ]6 O" |. H; B) h8 E! [13 敏化  sensitization
14 汞齐化  amalgamation (blue dip)
" _: l% K- ?- P9 c* e' M15 刷光  brushing
16 乳化除油  emulsion degreasing
17 除氢  removal of hydrogen (de-embrittlement )
* M* M. G7 c% s0 ~# v( k18 退火  annealing
, x/ P' \( l' d" [! ?+ Y0 C5 u19 逆流漂洗  countercurrent rinsing
  ^8 j6 Q- z3 F8 m3 a3 L  v20 封闭  sealing
; r# H3 ~  L+ x# P- O0 p21 着色能力  dyeing power
22 退镀  stripping
23 热扩散  thermal diffusion
1 f" _% s2 R5 W7 m. h! @* t$ H4 i1 e24 热熔  hot melting
. R: g7 _; V% g3 X1 z25 着色  colouring
26 脱色  decolorization
: a' @& r" M2 ]9 I6 y0 d6 L27 喷丸  shot blasting
28 喷砂  sand blasting
7 ?( G8 h5 r  I& ^& F) e29 喷射清洗  spray rinsing
30 超声波清洗  ultrasonic cleaning
31 弱浸蚀  acid dipping
. ?* H. g" D6 o32 强浸蚀  pickling
8 F1 r. J+ r& z$ A9 W9 Z  y33 滚光  barrel burnishing
  @& V- @3 {8 K34 磨光  grinding

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接上材料和设备
% U" a$ W2 b/ t' y$ A- }: [1 水的软化 softening of water
0 {4 Y" @& t' E) L2 汇流排 busbar
3 阳极袋 anode bag
4 光亮剂 brightening agent (brightener)
; f; U% u- z5 E0 g: c- q. `5 助滤剂 filteraid
6 阻化剂 inhibitor
  U# V9 B, m  w2 b- t- d+ s7 表面活性剂 surface active agent(surfactant)
8 乳化剂 emulsifying agent(emulsifier)
9 配位剂 complexant
10 绝缘层 insulated layer(resist)
11 挂具(夹具)  plating rack
12 润湿剂 wetting agent
7 U: L$ w% S$ F  |% x4 e13 离心干燥机 centrifuge
6 H  G& O( M; {* N, _4 n8 v14 添加剂 addition agent(additive)
! q7 }$ D! C: \/ h! q15 缓冲剂 buffer
16 移动阴极 swept cathode
4 e  s( J$ f: z) `3 C% }17 隔膜 diaphragm
6 L2 s) w  L9 Q/ [18 整合剂 chelating agent
19 整平剂 leveling agent
, Q# r4 l6 Z6 U5 g! {20 整流器 rectifier
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镀覆方法
% C0 [" A' }: d1 化学气相沉积  chemical vapor deposition
; K2 Q# i1 ~5 g, I5 A3 r' S2 物理气才目沉积  physical vapor deposition
% `( |/ j5 S: i! B2 B8 g& b! U  n3 c3 化学钝化  chemical passivation
4 化学氧化  chemical oxidation
5 阳极氧化  anodizing
8 T/ b9 E) m; e5 v! z( s" x6 化学镀(自催化镀)  autocalytic plating
7 激光电镀  1aser electroplating
# H3 Z; Y& K, s7 b8 闪镀  flash(flash plate)
9 电镀  electroplating
5 G3 s) ?, I& @7 `10 机械镀  mechanical plating
11 浸镀  immersion plate
+ ^, W$ k, C9 F) k% l7 k# l12 电铸  electroforming
13 叠力口电流电镀  superimposed current electroplating
14 光亮电镀  bright plating
15 合金电镀  alloy plating
16 多层电镀  multiplayer plating
17 冲击镀  strike plating
7 K: l. _: @! Q18 金属电沉积  metal electrodeposition
19 刷镀  brush plating
20 周期转向电镀  periodic reverse plating
) {8 z' o8 Y' ?" |* L* U5 L0 i21 转化膜  conversion coating
22 挂镀  rack plating
! o+ R/ q! w. P23 复合电镀(弥散电镀)  composite plating
24 脉冲电镀  pulse plating
25 钢铁发蓝(钢铁化学氧化)  blueing (chemical oxide)
; S) u& J, h  @1 W% K) t. _26 高速电镀  high speed electrodeposion
27 滚镀  barrel plating
28 塑料电镀  plating on plastics
29 磷化  phosphating
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测试和检验
5 G& b4 Z( t/ G, O/ l1 大气暴露试验 atmospheric corrosion test
2 中性盐雾试验(NSS试验)  neutral salt spray test(NSS-test)
3 不连续水膜 water break
4 pH计  pH meter
5 孔隙率  porosity
6 内应力  internal stress
7 电导仪  conductivity gauge
8 库仑计(电量计)  coulomb meter
9 旋转圆盘电极  rotating disk electrode
5 b! v! I) j6 W; ~# x10 旋转环盘电极  rotating ring disk electrode
" M- j) h4 v) n( o4 H( z4 L11 针孔  pores
) {; a% x5 i+ F12 铜加速盐雾试验(CASS试验)  copper accelerated salt spray
6 k3 a0 y+ ~% T5 T; ~9 B  K        (CASS test )
6 f" I( {- p- x- ^% c13 参比电极  reference electrode
2 B' A  B( R$ ]) U+ K14 甘汞电极  calomel electrode
" t* V/ t6 [& ~15 可焊性  solder ability
: S2 P0 I$ G% q7 A  i16 硬度  hardness
7 ]! e7 N% \3 ^* K$ n9 T+ M! y17 金属变色  tarnish
/ }) z3 F6 b% s# R18 点滴腐蚀试验  dropping corrosion test
19 玻璃电极 glass electode
/ j0 k( y8 P! l20 结合力  adhesion
2 L* n- @/ I* K& E7 Y0 H7 T21 哈林槽  Haring cell
22 恒电势法  potentiostatic method
23 恒电流法  galvanostatic method
24 交流电流法  a.c method
25 树枝状结晶  trees
5 n* F3 Q7 Z% k+ Y. I6 r26 脆性  brittleness
0 q7 l* Z5 e! A27 起皮  peeling
28 起泡  blister
4 e: I- b- Q; g1 t% w$ I( Z( r. ]7 `29 剥离  spalling
$ s( g! a# J0 J5 h7 Z30 桔皮  orange peel